Impact of package parasitics on the EMC performance of smart power SoCs

TitoloImpact of package parasitics on the EMC performance of smart power SoCs
Publication TypeConference Paper
Year of Publication2009
AuthorsMerlin, M., and F. Fiori
Conference NameEuropean Microelectronics and Packaging Conference (EMPC 2009)
Date Published06/2009
Keywordselectromagnetic compatibility, electromagnetic interference, EMC, EMI, IC electromagnetic emission, on-chip parasitic capacitors, package parasitic elements, power integrated circuits, silicon substrate, smart power, SoC, system-on-chip